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Quality & Manufacturing

Overview of our manufacturing partners, quality management systems, and device-level QA/QC.

Quality management

  • Documented quality management system aligned to ISO 9001 practices; environmental controls aligned to ISO 14001.
  • Controlled BOM and revision management (ECR/ECN), with change notices per our Lifecycle & PCN.
  • Supplier qualification and periodic audits; material certifications retained (RoHS/REACH).

Build standards

  • Workmanship to IPC‑A‑610 (class appropriate for the product and use case).
  • ESD controls per ANSI/ESD S20.20 and moisture sensitivity handling per JEDEC J‑STD‑033.
  • Storage, bake, and handling procedures for MSL components; stencil and reflow profiles under document control.

Inspection and test

  • Incoming quality control (IQC), in‑process AOI, and X‑ray inspection where applicable (e.g., BGA).
  • Electrical verification (ICT where applicable) and 100% functional test before pack‑out.
  • Calibrated test equipment with periodic verification (traceable where applicable).

Subsystem verification

  • Power: input ranges, regulators, brownout behavior, and protection circuits.
  • Processing: MCU/SoC boot, clocks, memory, and secure elements where applicable.
  • Interfaces: USB/UART/SPI/I2C/GPIO exercised via automated fixtures.
  • Sensing/IO: attached sensors and indicators validated against expected ranges.
  • Connectivity: radio front‑end paths and antenna ports verified per RF QA/QC below.

RF QA/QC

  • Per‑device RF test against documented limits (e.g., conducted power, sensitivity, spectral masks as applicable).
  • Use of a characterized reference device ("golden unit") to verify test fixtures and compensate drift.
  • Retention of test results with device identifier, firmware version, and timestamp.

Nonconformance and CAPA

  • Documented NCR process with containment, root‑cause, and corrective/preventive actions (CAPA).
  • Sampling plans (e.g., AQL) used for incoming/outgoing inspections as appropriate.
  • Rework/repair tracked against serialization with retest before release.

Serialization and traceability

  • Per‑device serialization (e.g., 2D code/QR) linked to lot, key components, test results, and firmware build.
  • Traveler and pack‑out records retained per internal retention policy.

Environmental and reliability

  • Design and verification to the product’s intended operating range; see Operating & Environmental Specs.
  • Optional stress or burn‑in based on product risk assessment.

Materials and compliance

Firmware & software quality

  • Version‑controlled builds with automated unit/integration tests and static analysis where applicable.
  • Secure firmware delivery: signing/verification, staged rollouts, and safe rollback strategy.
  • OTA update policy documented; release notes and compatibility guidance maintained.
  • SBOM available on request; vulnerability intake and remediation aligned with our Security policy.
  • Backward compatibility: semantic versioning and deprecation windows to preserve existing integrations.
  • Future‑proofing: maintain stability for wire protocols, storage schemas, and public APIs.
  • Compatibility testing matrix across supported hardware revisions and prior firmware branches.
  • Configuration/data migrations included in releases; safe rollback paths validated in pre‑release testing.
  • LTS release tracks receive critical fixes without requiring major feature upgrades.